XS-VS06J19-X90Y70-940

This is just one of our 940nm and FOV specifications, we also have different chip power products and FOV options. POWER:1/2/4W ; FOV:60*45,72*58,90*70,110*90

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FEATURES

AlN Package

High Radiation Intensity

Suitable for SMT assembly

   High uniformity surface light source output

 

APPLICATION

Facial Recognition

Gesture Recognition

3D scan

People Counting

Volume Measurement

Skeletal tracking

Avoid Obstacle

AR/VR

Absolute maximum rating:

Items symbol Maximum rating unit
Operating temperature TOPR 0℃ ~+80℃
storage temperature TSTG -40℃ ~+100℃
Soldering temperature TSOL 260℃ for 5sec

Optical property:

project condition Min Avg Max unit

Output power

If=2.5A,20℃ Heat-sink

- 2.0 - W

Threshold current

- - 0.5 - A

Operating voltage

If=2.5A,20℃ Heat-sink

- 2.1 2.4 V

Slope efficiency

IF=2.5A - 1.0 - W/A

Power conversion efficiency

If=2.5A,20℃ Heat-sink

- 41 - %
Angle

2θ1/2(X)

- 90 - deg
Angle

2θ1/2(Y)

- 70 - deg
Wavelength

Pout,20℃ Heat-sink

930 940 950 nm

Wavelength temperature drift

If=2.5A,△λ/△T

- 0.07 - nm
tr/tf       1

ns

 

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