XS-IR02A05-600

We can provide customers with special light output chip led. Can adapt to a variety of sizes of infrared touch screen applications. Support single point, multi-touch customer needs.

PRODUCT MANUALRETURN >>

FEATURES

Peak wavelength λp=940nm

Low forward voltage

Pb free

Meet ROHS standards

Compatible With Infrared Reflow Solder Process. 

APPLICATION

Infrared applied system

PCB mounted infrared sensor

Infrared emitting for miniature light barrier

Floppy disk drive

Optoelectronic switch

 

ELECTRICAL PERFORMANCE CHARACTERISTICS

project symbol Maximum rating unit Ambient temperature
Power dissipation Pd 100 mW Ta=25℃
Forward current IF ≤70 mA Ta=25℃
Reverse voltage VR 5 V Ta=25℃
Operating temperature TOPR -30℃ to+85℃ -
storage temperature TSTG -40℃ to+100℃ -
Soliering temperature TSOL 260℃ for 5sec -

LIGHT PERFORMANCE CHARACTERISTICS

project symbol condition Minimal average maximum unit
Radiant Intensity Ie IF=5mA - 8 10 mW/sr
Half  Angle θ1/2 - - 60 - Deg
Peak Wavelength 入P IF=5mA - 850 - nm
Spectral Bandwidth △入 IF=5mA - 35 - nm
Forward voltage VF IF=5mA 1.6 1.9 V
Reverse current IP VR=5.0V - - 10 uA

 

 

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