XSSY semiconductor offers

LED Packaging Services
Optical Design Services
Combined LED,optical and circuit design for complex module
Production in test
Production in volume
  • LED Packaging Services

    IR-LEDPower.0.15W ,0.5W,1W,1.5W,2W,3W, 8W
    IR-LED angle: 30°,45°,60°,100°,120°
    Package type: PLCC ,COB, CHIP,EMC
  • Complex module Services

    Combine LED ,Optical and circurt design
    Mechanical and Thermal design
    Production in test
  • Optical Design Services

    Material :PMMA,PC,Epoxy
    Property :Tailored transmission
    Mirco-Optical of Package for LED
    Mold design and processing

Facilities

.Class 10K clean rooms,and assembly stations.
.Die attach (die bonder, vacuum mixing, thermal/epoxy), Die shear tester
.Wire bond, ribbon bond, Wire bond pull tester
.Laser Marked
.Mold Surface preparation (grind, polish, metallization)
.Machine shop
.Incoming inspection system
.Screening/burn-in, accelerated aging
.Mechanical shock and vibration.
.Damp heat , temperature cycle and thermal shock

Product Qualification

  • System Certification

    ISO9001-2015 ISO14001-2015
  • certified product

    ROHS REACH IEC62471

 

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